Epoxy Encapsulant Material Powder

Epoxy Encapsulant Material Powder About

Product Overview

Our Epoxy Powder Encapsulation Materials (EPEM) are premium-grade, thermosetting chemical formulations engineering specifically for the insulation, sealing, and structural protection of electronic components. Combining high-purity epoxy resins, latent curing agents (hardener), mineral fillers (such as fused silica), and proprietary flame retardants, this material is delivered as a fine, free-flowing granulated powder optimized for automated electrostatic fluid bed coating, fluid bed dipping, and transfer molding processes.

Designed to meet the stringent reliability standards of 2026 automotive, industrial, and consumer electronics, our EPEM series provides an impenetrable barrier against moisture, thermal shock, mechanical impact, and electrical breakdown.

Product Features & Advantages

Exceptional Moisture Resistance: Formulated to successfully pass IPC/JEDEC Moisture Sensitivity Level 2 (MSL 2) and MSL 3 testing, drastically reducing the popcorn effect during reflow soldering.

Superior Adhesion: Modified with specialized adhesion promoters that create robust covalent bonds across diverse substrates, including Bare Copper, Silver-plated Leadframes, FR4, and Ceramic surfaces.

Thermal Shock Endurance: Demonstrates zero delamination or cracking after 1,000 continuous thermal cycles ranging from $-55circtext{C}$ to $+150circtext{C}$.

Excellent Flowability: Controlled particle size distribution (typically D50 within 4070 $mu$m) ensures void-free, uniform encapsulation around complex geometries and under tight wire-bond clearances.

The following data represents standard verified baseline properties for our high-reliability encapsulation grades (tested under applicable ASTM and IPC-TM-650 standards):

A. Thermal & Physical Properties

B. Electrical & Insulation Performance

C. Chemical & Processing Attributes

Applications

Automotive parts

Semiconductor devices

Semiconductor wafers

Electronic components

Heat-resistant components

Storage, Packaging, and Shelf Life

Storage Conditions: Epoxy powder is a chemically reactive thermosetting system. It must be stored in its original sealed airtight packaging in a climate-controlled cold storage environment at temperatures between $2circtext{C}$ and $8circtext{C}$. Avoid exposure to moisture and direct sunlight.

Shelf Life: 6 months from the date of manufacture when stored at the designated cold temperatures.

Packaging: Available in standard 10 kg or 20 kg moisture-barrier PE-lined boxes.

Pre-heating Note: Before opening the container for production, the powder must be allowed to equilibrate to room temperature ($22circtext{C}$ to $25circtext{C}$) for at least 24 hours to prevent moisture condensation within the material.

Superior Insulation for Electronics

This epoxy encapsulant offers robust dielectric strength, ensuring secure insulation for sensitive electronic components and printed circuit boards. Its high adhesion to metal and PCB substrates guarantees stable protection for a wide range of devices, minimizing the risk of electrical breakdown in challenging environments.


Efficient Heat Dissipation and Protection

Designed with moderate thermal conductivity, the encapsulant assists in transferring heat away from critical electronic parts, which enhances performance and extends component lifespan. Combined with excellent moisture resistance and high impact hardness, it ensures durable, long-lasting protection under varying operational conditions.


Convenient Application and Storage

The epoxy encapsulant powder mixes to a low-to-medium viscosity for easy application, with a generous pot life of up to 60 minutes. It can be cured at room temperature or with heat, suiting diverse production setups. The product's 12-month shelf life and customizable packaging add flexibility and convenience to usage and supply chain management.